Molybdenum Components features an exceptionally high melting point of 2623 °C, allowing it to maintain a stable solid structure without softening, melting, or deformation even under extreme temperatures above 1500 °C. It offers excellent high-temperature strength and enhanced creep resistance through micro-element doping, ensuring long-term dimensional stability under sustained thermal loads. In addition, its superior electrical and thermal conductivity enables efficient heat transfer and dissipation, making it ideal for electronic and vacuum applications. With a low coefficient of thermal expansion, molybdenum plate minimizes thermal stress during rapid temperature fluctuations, ensuring precision and reliability in high-accuracy environments such as semiconductor equipment. Advanced processing techniques further provide good machinability, allowing the material to be fabricated into complex shapes while maintaining its performance, meeting the diverse demands of high-temperature industrial applications.